Flexible display device

ABSTRACT

A flexible display device includes a protection member, a first adhesion member, a display member, a second adhesion member, and a window member. A thickness of the display member is less than a sum of thicknesses of the protection member and the window member. The display member includes a display panel layer, a touch sensing layer, and a reflection prevention layer integrated with each other to reduce a thickness of the flexible display device. The reduction in thickness enables the flexible display device to be bent with a relatively small radius of curvature, as well as to be repeatedly bent (or otherwise flexed) with reduced potential for delamination of the first and second adhesion members.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.16/299,593, filed Mar. 12, 2019, which issued as U.S. Pat. No.11,075,251, which is a Continuation of U.S. patent application Ser. No.15/285,219, filed Oct. 4, 2016, which issued as U.S. Pat. No.10,347,700, and which claims priority to and the benefit of KoreanPatent Application No. 10-2016-0036371, filed Mar. 25, 2016, each ofwhich is hereby incorporated by reference for all purposes as if fullyset forth herein.

BACKGROUND Field

The present disclosure relates to a flexible display device, and, moreparticularly, to a flexible display device capable of being repeatedlybent or otherwise flexed.

Discussion of the Background

Electronic devices, such as smartphones, digital cameras, laptopcomputers, tablets, navigational aids, televisions, and the like, maypermit users to intentionally deform the device in various manners andshapes. In this manner, a display device (e.g., a flat panel displaydevice) of an electronic device may also be deformed in correspondencewith the deformation of the electronic device. As such, flexible displaydevices, such as curved display devices, bent display devices, rolleddisplay devices, and the like, are of interest.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known to a person of ordinary skill in the art.

SUMMARY

One or more exemplary embodiments provide a flexible display device withimproved durability.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

According to one or more exemplary embodiments, a flexible displaydevice includes: a protection member forming a first outer surfaceexposed to an outside of the flexible display device; a window memberforming a second outer surface exposed to the outside; a display memberdisposed between the protection member and the window member; a firstadhesion member to couple the display member to the protection member;and a second adhesion member to couple the display member to the windowmember. The display member includes a display panel layer forming afirst display panel surface and a second display panel surface. Thedisplay panel layer includes: a display area including a plurality oflight emitting areas and a non-light emitting area adjacent to theplurality of the light emitting areas; and a non-display area adjacentto the display area. The display member further includes: a touchsensing layer forming a first base surface; and a reflection preventionlayer forming a second base surface. The touch sensing layer is disposeddirectly on one of the first display panel surface, the second displaypanel surface, and the second base surface. The reflection preventionlayer is disposed directly on the second display panel surface or thefirst base surface. A thickness of the display member is less than a sumof thicknesses of the protection member and the window member.

According to one or more exemplary embodiments, a flexible displaydevice includes: a protection member forming a first outer surfaceexposed to an outside of the flexible display device; a window memberforming a second outer surface exposed to the outside; a display memberdisposed between the protection member and the window member; a firstadhesion member to couple the display member to the protection member;and a second adhesion member to couple the display member to the windowmember. The display member includes a display panel layer forming afirst display panel surface disposed directly on the first adhesionmember and a second display panel surface. The display panel layerincludes: a display area including a plurality of light emitting areasand a non-light emitting area adjacent to the plurality of lightemitting areas; and a non-display area adjacent to the display area. Thedisplay member further includes a touch sensing layer forming: a firstbase surface disposed directly on the second adhesion member; and asecond surface opposing the first base surface, the second surface beingdisposed directly on the second display panel surface. The touch sensinglayer includes: a plurality of first conductive patterns overlappingwith the non-light emitting area, the plurality of first conductivepatterns being disposed directly on the second display panel surface; aplurality of second conductive patterns overlapping with the non-lightemitting area; and a touch insulation layer configured to insulate thefirst conductive patterns from the second conductive patterns. The touchinsulation layer includes: a black matrix overlapping with the non-lightemitting area and the non-display area; and a plurality of color filtersrespectively overlapping with the plurality of light emitting areas. Athickness of the display member is less than a sum of thicknesses of theprotection member and the window member.

According to one or more exemplary embodiments, a flexible displaydevice includes: a protection member forming a first outer surfaceexposed to an outside of the flexible display device; a window memberforming a second outer surface exposed to the outside; a display memberdisposed between the protection member and the window member; a firstadhesion member to couple the display member to the protection member;and a second adhesion member to couple the display member to the windowmember. The display member includes a display panel layer including afirst display panel surface disposed directly on the first adhesionmember and a second display panel surface. The display panel layerincludes: a display area including a plurality of light emitting areasand a non-light emitting area adjacent to the plurality of lightemitting areas; and a non-display area adjacent to the display area. Thedisplay member further includes a touch sensing layer forming: a firstbase surface disposed directly on the second adhesion member; and asecond surface opposing the first base surface, the second surface beingdisposed directly on the second display panel surface. The display panellayer includes: a first metal layer overlapping with the display areaand the non-display area; a transparent conductive layer disposeddirectly on the first metal layer; and a second metal layer disposeddirectly on the transparent conductive layer. A thickness of the displaymember is less than a sum of thicknesses of the protection member andthe window member.

According to one or more exemplary embodiments, a method ofmanufacturing a flexible display device includes forming a displaymember configured to display an image, the display member including: adisplay panel layer configured to generate the image; a touch sensinglayer configured to sense touch interactions associated with the image,the touch sensing layer directly contacting the display panel layer; anda reflection prevention layer configured to reduce external lightreflection from the display panel layer, the reflection prevention layerdirectly contacting the display panel layer or the touch sensing layer.The method further includes: coupling, via a first adhesive member, aprotection member to a first side of the display member; and coupling,via a second adhesive member, a window member to a second side of thedisplay member, the second side opposing the first side. A thickness ofthe display member is less than a sum of thicknesses of the protectionmember and the window member.

According to one or more exemplary embodiments, a method ofmanufacturing a flexible display device includes: forming one or morefirst layers configured to generate an image on a first outermost layerof the one or more first layers; and forming one or more second layersconfigured to reduce external light reflection off the one or more firstlayers. The one or more second layers include: a second outermost layerdirectly contacting the first outermost layer; and a third outermostlayer opposing the second outermost layer. The method further includesforming one or more third layers configured to sense touch interactionsin association with the image. The one or more third layers includes: afourth outermost layer directly contacting the third outermost layer;and a fifth outermost layer opposing the fourth outermost layer. Themethod further includes: coupling, via a first adhesive member, one ormore fourth layers to the one or more first layers, the one or morefourth layers being configured to at least protect the one or more firstlayers; and coupling, via a second adhesive member, one or more fifthlayers to the fifth outermost layer, the one or more fifth layers beingconfigured to form a window to the one or more first layers. A thicknessof the one or more first layers is less than a sum of thicknesses of theone or more fourth layers and the one or more fifth layers.

According to one or more exemplary embodiments, a method ofmanufacturing a flexible display device includes forming a displaymember including a display panel layer configured to generate an imagein a display area. The display area includes: a plurality of lightemitting areas; and a plurality of non-light emitting areas. The displaymember further includes a touch sensing layer configured to: sense touchinteractions associated with the image; and reduce a reflective index ofexternal light. The method further includes: coupling, via a firstadhesive member, a protection member to a first side of the displaymember; and coupling, via a second adhesive member, a window member to asecond side of the display member, the second side opposing the firstside. A thickness of the display member is less than a sum ofthicknesses of the protection member and the window member. The touchsensing layer includes: a plurality of conductive patterns configured tosense the touch interactions, the plurality of conductive patterns beingformed directly on the display panel layer and overlapping with theplurality of non-light emitting areas; a touch insulation layer coveringthe plurality of first conductive patterns, the touch insulation layerincluding a plurality of openings overlapping with the plurality oflight emitting areas; and a plurality of color filters formed directlyon the display panel layer in the plurality of openings, the pluralityof color filters being configured to reduce the reflective index of theexternal light.

According to one or more exemplary embodiments, a flexible displaydevice includes a display panel layer, a touch sensing layer, a windowmember, and a protection member. The display panel layer includes: anencapsulation layer; a light emitting layer configured to emit lightonto a surface of the encapsulation layer; and electrodes configured todrive the light emitting layer. The touch sensing layer is disposeddirectly on the surface of the encapsulation layer. The window member iscoupled, via a first adhesive, directly on a surface of the touchsensing layer; and coupling, via a second adhesive, to a surface of thedisplay panel layer disposed on the surface of the thin filmencapsulation layer. A sum of thicknesses of the display panel layer andthe touch sensing layer is less than a sum of thicknesses of theprotection member and the window member. At least one of the electrodesincludes: a first metal layer; a transparent conductive layer disposeddirectly on the first metal layer; and a second metal layer disposeddirectly on the transparent conductive layer.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1A is a perspective view of illustrating a first operational stateof a flexible display device, according to one or more exemplaryembodiments.

FIG. 1B is a perspective view illustrating a second operational state ofthe flexible display device of FIG. 1A, according to one or moreexemplary embodiments.

FIG. 1C is a perspective view illustrating a third operational state ofthe flexible display device of FIG. 1A, according to one or moreexemplary embodiments.

FIG. 2A is a cross-sectional view of the flexible display device of FIG.1A in the first operational state, according to one or more exemplaryembodiments.

FIG. 2B is a cross-sectional view of the flexible display device of FIG.1B in the second operational state, according to one or more exemplaryembodiments.

FIG. 2C is a cross-sectional view of the flexible display device of FIG.1C in the third operational state, according to one or more exemplaryembodiments.

FIG. 3A is a cross-sectional view of a flexible display device in asecond operational state, according to one or more exemplaryembodiments.

FIG. 3B is a cross-sectional view of the flexible display device of FIG.3A in a third operational state, according to one or more exemplaryembodiments.

FIGS. 4A, 4B, 4C, and 4D are cross-sectional views of flexible displaydevices in first operational states, according to one or more exemplaryembodiments.

FIG. 5 is a perspective view of a flexible display panel, according toone or more exemplary embodiments.

FIG. 6 is an equivalent circuit diagram of a pixel of the flexibledisplay panel of FIG. 5 , according to one or more exemplaryembodiments.

FIG. 7 is a partial plan view of an organic light emitting displaypanel, according to one or more exemplary embodiments.

FIGS. 8A and 8B are partial cross-sectional views of the organic lightemitting display panel of FIG. 7 , according to one or more exemplaryembodiments.

FIGS. 9A, 9B, and 9C are cross-sectional views of thin filmencapsulation layers, according to one or more exemplary embodiments.

FIGS. 10A, 10B, and 10C are cross-sectional views of display devices,according to one or more exemplary embodiments.

FIGS. 11A and 11B are plan views illustrating conductive layers of atouch detection member, according to one or more exemplary embodiments.

FIG. 12A is a partial enlarged view of area AA in FIG. 11A, according toone or more exemplary embodiments.

FIGS. 12B and 12C are a partial cross-sectional views of FIG. 12Arespectively taken along sectional lines I-I′ and II-II′, according toone or more exemplary embodiments.

FIG. 13A is a partial enlarged view of area BB in FIG. 11B, according toone or more exemplary embodiments.

FIGS. 13B and 13C are partial cross-sectional views of FIG. 13Arespectively taken along sectional lines III-III′ and IV-IV′, accordingto one or more exemplary embodiments.

FIG. 14A is a partial enlarged view of area CC in FIG. 11B, according toone or more exemplary embodiments.

FIG. 14B is a partial cross-sectional view of FIG. 14A taken alongsectional line V-V′, according to one or more exemplary embodiments.

FIGS. 15A and 15B are plan views illustrating conductive layers of atouch detection member, according to one or more exemplary embodiments.

FIG. 15C is a partial enlarged view of area CC in FIG. 15B, according toone or more exemplary embodiments.

FIG. 15D is a partial cross-sectional view of FIG. 15C taken alongsectional line VI-VI′, according to one or more exemplary embodiments.

FIGS. 16A, 16B, 16C, 16D, 16E, 16F, and 16G are cross-sectional views ofdisplay devices, according to one or more exemplary embodiments.

FIGS. 17A, 17B, 17C, and 17D are cross-sectional views of displaydevices, according to one or more exemplary embodiments.

FIGS. 18A, 18B, 18C, 18D, 18E, and 18F are cross-sectional views ofdisplay devices, according to one or more exemplary embodiments.

FIGS. 19A and 19B are cross-sectional views of a display device,according to one or more exemplary embodiments.

FIGS. 20A and 20B are cross-sectional views of cathodes of organic lightemitting diodes of display devices, according to one or more exemplaryembodiments.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail ofvarious exemplary embodiments. Therefore, unless otherwise specified,the features, components, modules, layers, films, panels, regions,and/or aspects of the various illustrations may be otherwise combined,separated, interchanged, and/or rearranged without departing from thedisclosed exemplary embodiments. Further, in the accompanying figures,the size and relative sizes of layers, films, panels, regions, etc., maybe exaggerated for clarity and descriptive purposes. When an exemplaryembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. Further, the DR1-axis, the DR2-axis, and theDR3-axis are not limited to three axes of a rectangular coordinatesystem, and may be interpreted in a broader sense. For example, theDR1-axis, the DR2-axis, and the DR3-axis may be perpendicular to oneanother, or may represent different directions that are notperpendicular to one another. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, components, regions, layers, and/or sections,these elements, components, regions, layers, and/or sections should notbe limited by these terms. These terms are used to distinguish oneelement, component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIGS. 1A, 1B, and 1C are perspective views respectively illustratingfirst, second, and third operational states of a flexible display deviceDD, according to one or more exemplary embodiments. FIGS. 2A, 2B, and 2Care cross-sectional views respectively illustrating the first, second,and third operational states of the flexible display device DD,according to one or more exemplary embodiments.

A display surface IS on which an image IM is displayed is parallel to asurface defined by a first directional axis DR1 and a second directionalaxis DR2. A normal direction of the display surface IS, i.e., athickness direction of the flexible display device DD, is indicated as athird directional axis DR3. A front surface (or a top surface) and arear surface (or a bottom surface) of each of the members (orcomponents) of the flexible display device DD are distinguished from oneanother in the third directional axis DR3. Directions indicated inassociation with the first to third directional axes DR1, DR2, and DR3are merely relative, and, as such, may be changed to differentdirections with respect to each other. Hereinafter, the first to thirddirections may be expressed by the same reference symbols as thedirections indicated in association with the first to third directionalaxis DR1, DR2, and DR3, respectively.

A foldable display device is illustrated as an example of the flexibledisplay device DD of FIGS. 1A to 1C and 2A to 2C. It is contemplated,however, that exemplary embodiments are not limited thereto or thereby.For instance, the flexible display device DD may be provided as arollable display device that may be wound. It is noted that the flexibledisplay device DD may be used for large-scale electronic apparatuses,such as televisions, monitors, etc., and middle and small-scaleelectrode apparatuses, such as mobile phones, tablets, notebooks,personal computers, navigation units for vehicles, game consoles, smartwatches, etc.

As illustrated in FIG. 1A, the display surface IS of the flexibledisplay device DD may be divided into a plurality of areas. The flexibledisplay device DD may include a display area DD-DA on which the image IMis displayed (or perceived), and a non-display area DD-NDA that isdisposed adjacent to (or outside of) the display area DD-DA. Thenon-display area DD-NDA may be an area on which the image IM is notdisplayed. A flower vase is illustrated as an example of the image IM inFIG. 1A. For example, the display area DD-DA may have a rectangularshape, and the non-display area DD-NDA may surround the display areaDD-DA. It is contemplated, however, that exemplary embodiments are notlimited thereto or thereby. For example, the shape of the display areaDD-DA and the shape of the non-display area DD-NDA may be relativelydesigned with respect to each other. To this end, the respective shapesof the display area DD-DA and the non-display area DD-NDA may be thesame as one another or different from one another.

As seen in FIGS. 1A to 1C, the flexible display device DD may include abending area BA that is bendable with respect to a bending axis BX, andfirst and second non-bending areas NBA1 and NBA2 that are not bendable.As illustrated in FIG. 1B, the flexible display device DD may be bentinward so that the display surface IS of the first non-bending area NDA1and the display surface IS of the second non-bending area NBA2 face eachother. As illustrated in FIG. 1C, the flexible display device DD may bebent outward to expose the display surface IS to the outside.

According to one or more exemplary embodiments, the flexible displaydevice DD may include a plurality of bending areas BA. In addition, thebending areas BA may be defined to correspond to a configuration of theflexible display device DD that is manipulated by a user, e.g., thebending areas may be dynamically configured by the user. For example,the bending area BA may be defined in parallel to the first directionalaxis DR1 or defined in a diagonal direction, unlike as shown in FIGS. 1Band 1C. In one or more exemplary embodiments, the flexible displaydevice DD may be configured to only repeat the operational modes ofFIGS. 1A to 1C.

As illustrated in FIGS. 2A to 2C, the display device DD includes aprotection member PM, a window member WM, a display member DM, a firstadhesion member AM1, and a second adhesion member AM2. The displaymember DM is disposed between the protection member PM and the windowmember WM. The first adhesion member AM1 is coupled to the displaymember DM and the protection member PM, and the second adhesion memberAM2 is coupled to the display member DM and the window member WM.

The protection member PM protects the display member DM. The protectionmember PM provides a first outer surface OS-L that is exposed to theoutside and an adhesion surface AS1 that adheres to the first adhesionmember AM1. Hereinafter, the adhesion surface AS1 of the protectionmember PM may be referred to as a first adhesion surface AS1 so as to bedistinguished from an adhesion surface of the other member. Theprotection member PM prevents external moisture, oxygen, debris, etc.,from being permeated into the display member DM and absorbs externalimpact. The protection member PM may include a plastic film as a baselayer.

According to one or more exemplary embodiments, the protection member PMmay include a material selected from the group consisting ofpolyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI),polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate(PC), poly(aryleneether sulfone), and a combination thereof. It iscontemplated, however, that a material for forming the protection memberPM is not limited to plastic resins. For example, the protection memberPM may be formed of an organic/inorganic composite material. Theprotection member PM may include a porous organic layer and an inorganicmaterial that is filled into pores of the organic layer.

In one or more exemplary embodiments, the protection member PM mayfurther include a functional layer disposed on a plastic film. Thefunctional layer may include a resin layer. The functional layer may beformed by a coating manner.

The window member WM protects the display member DM against externalimpact and provides an input surface to a user. The window member WMprovides a second outer surface OS-U that is exposed to the outside andan adhesion surface AS2 that adheres to the second adhesion member AM2.A display surface IS of FIGS. 1A to 1C may be the second outer surfaceOS-U. Hereinafter, the adhesion surface AS2 of the window member WM maybe referred to as a second adhesion surface AS2 so as to bedistinguished from an adhesion surface of the other member. The windowmember WM will be described later in more detail.

The display member DM includes a display panel layer DP, a touch sensinglayer TS, and a reflection prevention layer RPL that are integrated witheach other by a continuous process. Although the display member DM ofwhich the constituents are successively stacked from the display panellayer DP to the reflection prevention layer RPL is illustrated as anexample, exemplary embodiments are not limited thereto or thereby.According to one or more exemplary embodiments, the stacking order ofthe functional layers of the display member DM may be changed. Also, aportion of the functional layers may be omitted, or two functionallayers may be replaced with one functional layer.

The display panel layer DP generates the image (see reference symbol IMof FIG. 1A) corresponding to input image data. The display panel layerDP provides a first display panel surface BS1-L (or a base bottomsurface) and a second display panel surface BS1-U (or a base topsurface), which face each other in the thickness direction DR3. Thedisplay panel layer DP may be an organic light emitting display panel,an electrophoretic display panel, or an electrowetting display panel. Itis contemplated, however, that exemplary embodiments are not limited toa kind (or type) of display panel, and, as such, any suitable displaypanel may be utilized in association with exemplary embodimentsdescribed herein. For descriptive and illustrative convenience,exemplary embodiments will be described in association with an organiclight emitting display panel embodiment. The organic light emittingdisplay panel will be described later in more detail.

The touch sensing layer TS acquires coordinate information of anexternal input, e.g., user input. The touch sensing layer TS may bedisposed on (e.g., directly on) the second display panel surface BS1-U.The touch sensing layer TS provides a first base surface BS2 (or a touchbase surface). It is contemplated that the touch sensing layer TS may bemanufactured together with the display panel layer DP via a continuousprocess. For illustrative and descriptive convenience, the touch sensinglayer TS will be described in association with a capacitive touchdetection member embodiment. Exemplary embodiments, however, are notlimited thereto or thereby. For example, the touch sensing layer TS maybe replaced with another touch sensing layer including two types oftouch electrodes, such as an electromagnetic induction touch detectionmember. A capacitive touch sensing layer will be described later in moredetail.

The reflection prevention layer RPL may absorb light incident from theoutside or destructively interfere with the light to reduce externallight reflectance of the flexible display device DD. In one or moreexemplary embodiments, the reflection prevention layer RPL may bereplaced with an optical film for preventing external light from beingreflected, e.g., a polarizing film and a λ/4 wavelength film. Thereflection prevention layer RPL may be disposed on (e.g., directly on)the first base surface BS2. The reflection prevention layer RPL providesa second base surface BS3 (or a reflection prevention base surface). Inone or more exemplary embodiments, the reflection prevention layer RPLmay be manufactured together with the touch sensing layer TS via acontinuous process. The reflection prevention layer RPL will bedescribed later in more detail.

According to one or more exemplary embodiments, the touch sensing layerTS and the reflection prevention layer RPL that are formed by thecontinuous process, may reduce a thickness of the display device DD. Aconventional touch panel and conventional optical film that areseparately manufactured, may require a separate adhesion member so as toadhere to a conventional display panel. Also, each of the conventionaltouch panel and the conventional optical film that are separatelymanufactured, may have a determined thickness to satisfyself-durability. According to one or more exemplary embodiments, thetouch sensing layer TS and the reflection prevention layer RPL areformed by a continuous process, and, as such, may enable the adhesionmember to be omitted. In this manner, the touch sensing layer TS and thereflection prevention layer RPL may be disposed directly on the displaypanel layer DP with a thin thickness on the display panel layer DP.

Each of the first adhesion member AM1 and the second adhesion member AM2may be an optical clear adhesive film (OCA), an optical clear resin(OCR), or a pressure sensitive adhesive film (PSA). Each of the firstadhesion member AM1 and the second adhesion member AM2 may be formed ofa photocurable adhesive material or a heat-curable adhesive material. Itis contemplated, however, that exemplary embodiments are not limitedthereto to thereby.

Although not separately shown, the flexible display device DD mayfurther include a frame structure supporting the functional layers tomaintain the operational states illustrated in FIGS. 2A to 2C. The framestructure may include a joint structure or a hinge structure.

As illustrated in FIG. 2B, the flexible display device DD may be bentinward at a determined radius of curvature BR by, for instance, usermanipulation. Alternatively, as illustrated in FIG. 2C, the flexibledisplay device DD may be bent outward at a determined radius ofcurvature BR by, for example, user manipulation. It is also contemplatedthat the flexible display device DD may be bidirectionally bentaccording to user manipulation. The bidirectional bending may berepeatedly performed. The radius of curvature BR may be constantlymaintained. The first non-bending area NBA1 and the second non-bendingarea NBA2 may face each other and may be extend parallel to one another.The bending area BA may not be fixed in surface area, but be determinedaccording to the radius of curvature BR. The user may perceive an imagefrom the flexible display device DD in the non-bent state of FIG. 2A.

According to one or more exemplary embodiments, the protection member PMmay have a thickness of about 30 μm to about 80 μm. The window member WMmay have a thickness of about 20 μm to about 150 μm, e.g., about 25 μmto about 150 μm. The display member DM may have a thickness of about 30μm to about 50 μm. Each of the first adhesion member AM1 and the secondadhesion member AM2 may have a thickness of about 10 μm to about 80 μm.

Although each of the protection member PM, the window member WM, and thedisplay member DM may have a thickness according to one of theabove-noted ranges, the display member DM may be set to have a thicknessless than the sum of the thicknesses of the protection member PM and thewindow member WM. The thickness of the display member DM may represent athickness from the first display panel surface BS1-L to the seconddisplay panel surface BS1-U. Since the touch panel and the optical filmare integrated with the display panel layer DP, the adhesion members maybe omitted, and, as such, the touch sensing layer TS and the reflectionprevention layer RPL may decrease in thickness to satisfy theabove-described conditions. Since the display member DM decreases inthickness, tension/compression stresses that occur in the display devicewhen bent (or otherwise flexed) may be reduced.

A ratio of the sum of the thicknesses of the protection member PM andthe window member WM to the thickness of the display member DM(thickness of the display member DM:the sum of the thicknesses of theprotection member PM and the window member WM) may be about 1:1 to about1:8. In one or more exemplary embodiments, a ratio of the sum of thethicknesses of the protection member PM and the window member WM to thethickness of the display member DM may be about 1:1.2 to about 1:4. Forexample, when the display member DM has a thickness of about 30 μm toabout 50 μm, the sum of the thicknesses of the protection member PM andthe window member WM may be about 60 μm to about 120 μm. It is notedthat the protection member PM may have a thickness of about 30 μm toabout 50 μm, and the window member WM may have a thickness of about 30μm to about 70 μm.

A ratio between the thicknesses of the protection member PM and thewindow member WM may be about 4:1 to about 1:5. In one or more exemplaryembodiments, a ratio between the thicknesses of the protection member PMand the window member WM may be about 5:3 to about 3:7. As describedabove, when the protection member PM has a thickness of about 30 μm toabout 50 μm, the window member WM may have a thickness of about 30 μm toabout 70 μm.

A ratio between the thicknesses of the first and second adhesion membersAM1 and AM2 may correspond to that between the thicknesses of theprotection member PM and the window member WM. As the thicknessincreases, stress occurring when the flexible display device DD is bentmay increase. When repeatedly bent, each of the protection member PM andthe window member WM may be degraded. It is noted, however, that thefirst and second adhesion members AM1 and AM2 may reduce the stress toprevent the degradation of the protection member PM and the windowmember WM from occurring. Since a decreasing rate of the stressoccurring when the flexible display device DD is bent increases as theadhesion members AM1 and AM2 increase in thickness, the thicknesses ofthe first and second adhesion members AM1 and AM2 may be set tocorrespond to those of the protection member PM and the window memberWM. That is, an adhesion member adjacent to a member having a largethickness may also have a large thickness.

When a ratio between the thicknesses of the protection member PM and thewindow member WM is about 1:3, a ratio between the thicknesses of thefirst and second adhesion member AM1 and AM2 may be about 1:3. When aratio between the thicknesses of the protection member PM and the windowmember WM is about 1:1, a ratio between the thicknesses of the first andsecond adhesion member AM1 and AM2 may be about 1:1. It is contemplated,however, that the ratio between the thicknesses of the first and secondadhesion members AM1 and AM2 need not be the same as that between thethicknesses of the protection member PM and the window member WM.

The feature in which “the ratio between the thicknesses of the first andsecond adhesion members AM1 and AM2 corresponds to that between thethicknesses of the protection member PM and the window member WM” may bedefined as a feature in which the ratios have an error ranging fromabout +30% to about −30%. For example, when a ratio between thethicknesses of the protection member PM and the window member WM isabout 1:3, a ratio between the thicknesses of the first and secondadhesion members AM1 and AM2 may be about 1:3.9 to about 1:2.1.

As previously mentioned, as the number of adhesion members decrease, theflexible display device DD may decrease in thickness. When the flexibledisplay device DD decreases in thickness, even though the flexibledisplay device DD is repeatedly bent (or otherwise flexed), delaminationdefects of the adhesion member(s) may be reduced. Also, when theflexible display device DD decreases in thickness, the flexible displaydevice DD may be bent according to a smaller radius of curvature.

FIGS. 3A and 3B are cross-sectional views of a flexible display devicein second and third operational states, according to one or moreexemplary embodiments. FIGS. 4A to 4D are cross-sectional views flexibledisplay devices in first operational states, according to one or moreexemplary embodiments. The flexible display devices of FIGS. 3A, 3B, and4A to 4D are similar to the flexible display device DD of FIGS. 1A to 1Cand 2A to 2C, and, as such, duplicative descriptions have been omittedto avoid obscuring exemplary embodiments described herein. In thismanner, differences are primarily described below.

The flexible display device DD′ may be bidirectionally bent in the shapeillustrated in FIGS. 3A and 3B. The bending area BA′ may be bent in ashape that is more similar to a circular shape to increase a surfacearea of the bending area BA′ when compared to that of the being area BAof the flexible display device DD of FIGS. 1A to 1C and 2A to 2C. Also,the bending area BA′ may be bent at a radius of curvature BR′ greaterthan the radius of curvature BR illustrated in FIGS. 2B and 2C to reducestress of the bending area BA.

As illustrated in FIGS. 4A and 4B, functional layers may be changed instacking order. Referring to FIG. 4A, a touch sensing layer TS may bedisposed directly on a first display panel surface BS1-L. The firstadhesion member AM1 is coupled to the first base surface BS2 through thefirst adhesion surface AS1. The reflection prevention layer RPL may bedisposed directly on the second base surface BS1-U. The second adhesionmember AM2 is coupled to the second base surface BS3 through the secondadhesion surface AS2. Adverting to FIG. 4B, the reflection preventionlayer RPL may be disposed directly on the second display panel surfaceBS1-U. The touch sensing layer TS may be disposed directly on the secondbase surface BS3. The second adhesion member AM2 is coupled to the firstbase surface BS2 through the second adhesion surface AS2.

As illustrated in FIGS. 4C and 4D, the reflection prevention layer RPLthat is separately formed in FIGS. 4A and 4B may be combined withanother functional layer. In this manner, the reflection preventionlayer may constitute a portion of the touch sensing layer TS or aportion of a display panel layer DP. Referring to FIG. 4C, the touchsensing layer TS-R may also have the function of the reflectionprevention layer RPL. With reference to FIG. 4D, the display panel layerDP-R may also have the function of the reflection prevention layer RPL.As illustrated in FIGS. 4C and 4D, each of the touch sensing layers TS-Rand TS is disposed directly on the second display panel surface BS1-U.The first adhesion member AM1 is coupled to the first display panelsurface BS1-L through the first adhesion surface AS1.

FIG. 5 is a perspective view of a flexible display panel, according toone or more exemplary embodiments. FIG. 6 is an equivalent circuitdiagram of a pixel of the flexible display panel of FIG. 5 , accordingto one or more exemplary embodiments.

Hereinafter, the flexible display panel layer DP will be described as anorganic light emitting display panel layer DP. The organic lightemitting display panel layer DP includes a display area DA and anon-display area NDA on a plane. The second display panel surface BS1-Umay be divided into the display area DA and the non-display area NDA.The display area DA and the non-display area NDA of the second displaypanel surface BS1-U do not need to match the display area DD-DA and thenon-display area DD-NDA of the flexible display device DD of FIG. 1A.For example, the display area DA and the non-display area NDA of thesecond display panel surface BS1-U may be configured according astructure and/or design of the organic light emitting display panellayer DP.

As illustrated in FIG. 5 , the organic light emitting display panellayer DP includes a plurality of pixels PX disposed on the display areaDA. Although the plurality of pixels PX are shown as being arranged in amatrix shape, exemplary embodiments are not limited thereto or thereby.The plurality of pixels PX may be arranged in any suitable shape, suchas a non-matrix shape, e.g., a pantile shape.

FIG. 6 illustrates an example of an equivalent circuit of arepresentative pixel PXij to which an i-th scan line SLi and a j-thsource line DLj are connected. Although not separately shown, theplurality of pixels PX may have the same equivalent circuit asrepresentative pixel PXij. The pixel PXij includes at least twotransistors TR1 and TR2, at least one capacitor CAP, and an organiclight emitting device OLED. Although a pixel driving circuit includingtwo transistors TR1 and TR2 and one capacitor CAP is illustrated as anexample, exemplary embodiments are not limited to the configuration ofthe pixel driving circuit.

An anode of the organic light emitting device OLED receives a firstpower voltage ELVDD applied to a power line PWL through the secondtransistor TR2. A cathode of the organic light emitting device OLEDreceives a second power voltage ELVSS. The first transistor TR1 outputsa data signal applied to a j-th source line DLj in response to ascanning signal applied to the i-th scan line SLi. The capacitor CAPcharges a voltage to correspond to the data signal received from thefirst transistor TR1. The second transistor TR2 controls driving currentflowing through the organic light emitting device OLED to correspond toa voltage stored in the capacitor CAP.

FIG. 7 is a partial plan view of a portion of the organic light emittingdisplay panel of FIG. 5 , according to one or more exemplaryembodiments. FIGS. 8A and 8B are partial cross-sectional views of theorganic light emitting display panel of FIG. 7 , according to one ormore exemplary embodiments.

FIG. 7 corresponds to a portion DP-P of the organic light emittingdisplay panel of FIG. 5 . FIG. 8A is a partial cross-sectional view of aportion corresponding to the first transistor TR1 and the capacitor CAPof the equivalent circuit of FIG. 6 , whereas FIG. 8B is a partialcross-sectional view of a portion corresponding to the second transistorTR2 and the organic light emitting device OLED of the equivalent circuitof FIG. 6 . In FIGS. 8A and 8B, the first adhesion member AM1 and theexternal protection member PM disposed on a first outer surface OS-L areadditionally illustrated.

As illustrated in FIG. 7 , the display area DA is defined as a pluralityof light emitting areas PXA-R, PXA-G, and PXA-B and a non-light emittingarea NPXA on a plane defined by the first directional axis DR1 and thesecond directional axis DR2. FIG. 7 illustrates an example of threetypes of light emitting areas PXA-R, PXA-G, and PXA-B that are arrangedin a matrix shape. Organic light emitting devices that emit light havingthree colors different from each other may be disposed on the threetypes of light emitting areas PXA-R, PXA-G, and PXA-B, respectively. Itis also contemplated that, in one or more exemplary embodiments, theorganic light emitting devices that emit light having white colors maybe disposed on the three types of light emitting areas PXA-R, PXA-G, andPXA-B, respectively. In this manner, three types of color filters havingcolors different from each other may overlap the three types of lightemitting areas PXA-R, PXA-G, and PXA-B, respectively.

As used herein, a feature in which “light having a predetermined coloris emitted from the light emitting area” may include a case in whichlight generated in the light emitting device is emitted as it is, aswell as a case in which light generated in the corresponding lightemitting device is converted in color and then emitted. In one or moreexemplary embodiments, the plurality of light emitting areas PXA-R,PXA-G, and PXA-B may include four or more types of light emitting areas.

The non-light emitting area NPXA may be divided into first non-lightemitting areas NPXA-1 surrounding the light emitting areas PXA-R, PXA-G,and PXA-B and a second non-light emitting area NPXA-2 defining aboundary of the first non-light emitting areas NPXA-1. A driving circuitof the pixel corresponding to each of the first non-light emitting areasNPXA-1, e.g., the transistors TR1 and TR2 (see FIG. 6 ) or the capacitorCAP (see FIG. 6 ) may be disposed on each of the first non-lightemitting areas NPXA-1. The signal lines, e.g., the scan line SLi (seeFIG. 6 ), the source line DLj (see FIG. 6 ), and the power line PWL (seeFIG. 6 ) may be disposed on the second non-light emitting area NPXA-2.It is contemplated, however, that exemplary embodiments are not limitedthereto or thereby. For example, the first non-light emitting areasNPXA-1 and the second non-light emitting area NPXA-2 may not be dividedwith respect to each other.

Although not separately shown, in one or more exemplary embodiments,each of the light emitting areas PXA-R, PXA-G, and PXA-B may have ashape that is similar to a diamond shape. Further, according to one ormore exemplary embodiments, the organic light emitting devices that emitlight having four colors different from each other may be disposed onthe four types of light emitting areas that are repeatedly disposed.

As illustrated in FIGS. 8A and 8B, the organic light emitting displaypanel layer DP includes a base layer SUB, a circuit layer DP-CL, anorganic light emitting device layer DP-OLED, and a thin filmencapsulation layer TFE. The circuit layer DP-CL may include a pluralityof conductive layers and a plurality of insulation layers, and theorganic light emitting device layer DP-OLED may include a plurality ofconductive layers and a plurality of functional organic layers. The thinfilm encapsulation layer TFE may include at least one organic layer andat least one inorganic layer.

The base layer SUB may include a plastic substrate, a glass substrate, ametal substrate, or an organic/inorganic composite substrate, which areformed of polyimide, as the flexible substrate. The base layer SUB mayprovide a first display panel surface BS1-L. In one or more exemplaryembodiments, the base layer SUB may have a multi-layered structure. Thefirst adhesion member AM1 adheres to the first display panel surfaceBS1-L through the first adhesion surface AS1.

A semiconductor pattern AL1 (hereinafter, referred to as a firstsemiconductor pattern) of the first transistor TR1 and a semiconductorpattern AL2 (hereinafter, referred to as a second semiconductor pattern)of the second transistor TR2 are disposed on the base layer SUB. Thefirst and second semiconductor patterns AL1 and AL2 may be formed ofamorphous silicon that is formed at a relatively low temperature. Inaddition, each of the first and second semiconductor patterns AL1 andAL2 may be formed of a metal oxide semiconductor. Although notseparately shown, functional layers may be further disposed on a surfaceof the base layer SUB. The functional layers may include at least one ofa barrier layer and a buffer layer. The first and second semiconductorpatterns AL1 and AL2 may be disposed on the barrier layer or the bufferlayer.

A first insulation layer 12 covering the first and second semiconductorpatterns AL1 and AL2 is disposed on the base layer SUB. The firstinsulation layer 12 may include an organic layer and/or an inorganiclayer. In one or more exemplary embodiments, the first insulation layer12 may include a plurality of inorganic thin films. The plurality ofinorganic thin films may include a silicon nitride layer and a siliconoxide layer.

A control electrode GE1 (hereinafter, referred to as a first controlelectrode) of the first transistor TR1 and a control electrode GE2(hereinafter, referred to as a second control electrode) of the secondtransistor TR2 are disposed on the first insulation layer 12. A firstelectrode E1 of the capacitor CAP is disposed on the first insulationlayer 12. The first control electrode GE1, the second control electrodeGE2, and the first electrode E1 may be manufactured by the samephotolithographic process as the scan line SLi (see FIG. 4 ). That is,the first electrode E1 may be formed of the same material as the scanline SLi.

The first control electrode GE1, a second insulation layer 14 coveringthe first and second control electrodes GE1 and GE2 and the firstelectrode E1 is disposed on the first insulation layer 12. The secondinsulation layer 14 includes an organic layer and/or an inorganic layer.In one or more exemplary embodiments, the second insulation layer 14 mayinclude a plurality of inorganic thin films. The plurality of inorganicthin films may include a silicon nitride layer and a silicon oxidelayer.

The source line DLj (see FIG. 6 ) and the power line PWL (see FIG. 6 )may be disposed on the second insulation layer 14. An input electrodeSE1 (hereinafter, referred to as a first input electrode) and an outputelectrode DE1 (hereinafter, referred to as a first output electrode) ofthe first transistor TR1 are disposed on the second insulation layer 14.An input electrode SE2 (hereinafter, referred to as a second inputelectrode) and an output electrode DE2 (hereinafter, referred to as asecond output electrode) of the second transistor TR2 are disposed onthe second insulation layer 14. The first input electrode SE1 isbranched from the source line DLj. The second input electrode SE2 isbranched from the power line PWL.

A second electrode E2 of the capacitor CAP is disposed on the secondinsulation layer 14. The second electrode E2 may be manufactured by thesame photolithographic process as the source line DLj and the power linePWL, and, thereby, formed of the same material as the source line DLjand the power line PWL.

The first input electrode SE1 and the first output electrode DE1 areconnected to the first semiconductor pattern AL1 through first andsecond through holes CH1 and CH2, which pass through the first andsecond insulation layers 12 and 14, respectively. The first outputelectrode DE1 may be electrically connected to the first electrode E1.For example, the first output electrode DE1 may be connected to thefirst electrode E1 through a through hole (not shown) passing throughthe second insulation layer 14. The second input electrode SE2 and thesecond output electrode DE2 are connected to the second semiconductorpattern AL2 through third and fourth through holes CH3 and CH4, whichpass through the first and second insulation layers 12 and 14,respectively. According to one or more exemplary embodiments, at leastone of the first and second transistors TR1 and TR2 may be formed as abottom gate structure.

A third insulation layer 16 covering the first input electrode SE1, thefirst output electrode DE1, the second input electrode SE2, and thesecond output electrode DE2 is disposed on the second insulation layer14. The third insulation layer 16 includes an organic layer and/or aninorganic layer. In one or more exemplary embodiments, the thirdinsulation layer 16 may be formed of an organic material to provide aflat surface.

A pixel defining layer PXL and an organic light emitting device OLED aredisposed on the third insulation layer 16. An opening OP is defined inthe pixel defining layer PXL. The pixel defining layer PXL may beanother insulation layer. The opening OP of FIGS. 8A and 8B maycorrespond to openings OP-R, OP-G, and OP-B of FIG. 7 .

The anode AE of organic light emitting device OLED is connected to thesecond output electrode DE2 through a fifth through hole CH5 passingthrough the third insulation layer 16. The opening OP of the pixeldefining layer PXL exposes at least a portion of the anode AE. A holecontrol layer HCL may be commonly defined in the light emitting areasPXA-R, PXA-G, and PXA-B (see FIG. 7 ) and the non-light emitting areaNPXA (see FIG. 7 ). An organic light emitting layer EML and an electroncontrol layer ECL are successively formed on the hole control layer HCL.The hole control layer HCL includes at least one hole transfer layer,and the electron control layer ECL includes at least one electrontransfer layer. Thereafter, the cathode CE may be commonly formed on thelight emitting areas PXA-R, PXA-G, and PXA-B and the non-light emittingarea NPXA. The cathode CE may be formed by a deposition or sputteringprocess according to its layered structure.

The thin film encapsulation layer TFE encapsulating the organic lightemitting device layer DP-OLED is disposed on the cathode CE. The thinfilm encapsulation layer TFE protects the organic light emitting deviceOLED against moisture and foreign substances. In one or more exemplaryembodiments, the thin film encapsulation layer TFE provides a seconddisplay panel surface BS1-U. In one or more exemplary embodiments, abuffer layer (not shown) may be disposed on the thin film encapsulationlayer TFE, and, as such, may provide the second display panel surfaceBS1-U.

According to one or more exemplary embodiments, the light emitting areaPXA may be defined as an area from which light is emitted. The lightemitting area PXA may be defined to correspond to the anode AE or thelight emitting layer EML of the organic light emitting device OLED.Although the patterned organic light emitting layer EML is illustratedas an example, the organic light emitting layer EML may be commonlydisposed on the non-light emitting area NPXA (see FIG. 5 ) and the lightemitting areas PXA-R, PXA-G, and PXA-B (see FIG. 5 ). In this manner,the organic light emitting layer EML may emit white light.

FIGS. 9A to 9C are cross-sectional views of thin film encapsulationlayers, according to one or more exemplary embodiments. The thin filmencapsulation layers TFE1, TFE2, and TFE3 will be described withreference to FIGS. 9A, 9B, and 9C, respectively.

According to one or more exemplary embodiments, a thin filmencapsulation layer may include at least two inorganic thin films and anorganic thin film disposed between the at least two inorganic thinfilms. The inorganic thin films protect the organic light emittingdevice OLED against moisture, and the organic thin film protects theorganic light emitting device OLED against foreign substances, such asdust particles.

As illustrated in FIG. 9A, the thin film encapsulation layer TFE1 mayinclude n (n being a natural number) inorganic thin films IOL1 to IOLnincluding the first inorganic thin film IOL1 contacting the cathode CE(see FIG. 8B). The first inorganic thin film IOL1 may be defined as alower inorganic thin film, and the inorganic thin films except for thefirst inorganic thin film IOL1 of the n inorganic thin films IOL1 toIOLn may be defined as upper inorganic thin films. The thin filmencapsulation layer TFE1 includes n organic thin films OL1 to OLn. The norganic thin films OL1 to OLn and the n inorganic thin films IOL1 toIOLn may be alternately disposed with respect to each other. Theuppermost layer may be the organic layer or the inorganic layer. Each ofthe n organic thin films OL1 to OLn may generally have a thicknessgreater than that of each of the organic thin films IOL1 to IOLn.

In one or more exemplary embodiments, each of the n inorganic thin filmsIOL1 to IOLn may have a single layer structure formed of one material ora multi-layer structure respectively formed of materials different fromeach other. Each of the n organic thin films OL1 to OLn may be formed bydepositing organic monomers. The organic monomers may be acrylic-basedmonomers.

As illustrated in FIGS. 9B and 9C, the inorganic thin films of each ofthe thin film encapsulation layers TFE2 and TFE3 may be formed of thesame inorganic material or inorganic materials different from each otherand have the same thickness or thicknesses different from each other.The organic thin films of each of the thin film encapsulation layersTFE2 and TFE3 may be formed of the same organic material or organicmaterials different from each other and have the same thickness orthicknesses different from each other.

Referring to FIG. 9B, the thin film encapsulation layer TFE2 may includea first inorganic thin film IOL1, a first organic thin film OL1, asecond inorganic thin film IOL2, a second organic thin film OL2, and athird inorganic thin film IOL3 that are successively stacked on oneanother. The first inorganic thin film IOL1 may have a two-layerstructure. A first sub-layer S1 may be a lithium fluoride layer, and asecond sub-layer S2 may be an aluminum oxide layer. The first organicthin film OL1 may be a first organic monomer layer, the second inorganicthin film IOL2 may be a first silicon nitride layer, the second organicthin film OL2 may be a second organic monomer layer, and the thirdinorganic thin film IOL3 may be a second silicon nitride layer.

As illustrated in FIG. 9C, the thin film encapsulation layer TFE3 mayinclude a first inorganic thin film IOL10, a first organic thin filmOL1, and a second inorganic thin film IOL20 that are successivelystacked on one another. The first inorganic thin film IOL10 may have atwo-layer structure. A first sub-layer S10 may be a lithium fluoridelayer, and a second sub-layer S20 may be a silicon oxide layer. Thefirst organic thin film OL1 may be an organic monomer, and the secondinorganic thin film IOL20 may have a two-layer structure. The secondinorganic thin film IOL20 may include a first sub-layer S100 and asecond sub layer S200 that are deposited under different depositionenvironments than each other. The first sub-layer S100 may be depositedunder a lower power condition, and the second sub-layer S200 may bedeposited under a high power condition. Each of the first sub-layer S100and the second sub-layer S200 may be a silicon nitride layer.

FIGS. 10A, 10B, and 10C are cross-sectional views of display devices,according to one or more exemplary embodiments. For illustrative anddescriptive convenience, the reflection prevention layer RPL is shown asa single layer, and only a portion of the display panel layer DP isshown. As illustrated in FIGS. 10A to 10C, the touch sensing layer TSmay include a first conductive layer TS-CL1, a first touch insulationlayer TS-IL1, a second conductive layer TS-CL2, and a second touchinsulation layer TS-IL2.

Each of the first conductive layer TS-CL1 and the second conductivelayer TS-CL2 may have a single-layer structure or a multi-layerstructure in which a plurality of layers are stacked in the thirddirectional axis DR3. A conductive layer having a multi-layer structuremay include a transparent conductive layer and at least one metal layer.The conductive layer having the multi-layer structure may include metallayers formed of metals different from each other. The transparentconductive layer may be formed of indium tin oxide (ITO), indium zincoxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, ametal nano wire, and graphene. The metal layer may be formed of at leastone of molybdenum, silver, titanium, copper, aluminum, and an alloythereof.

Each of the first and second conductive layers TS-CL1 and TS-CL2 mayinclude a plurality of patterns. Hereinafter, a structure in which thefirst conductive layer TS-CL1 includes first conductive patterns, andthe second conducive layer TS-CL2 includes second conductive patternswill be described. Each of the first and second conductive patterns mayinclude touch electrodes and touch signal lines.

According to one or more exemplary embodiments, each of the first andsecond touch insulation layers TS-IL1 and TS-IL2 may be formed ofinorganic or organic material. The inorganic material may includesilicon oxide or silicon nitride. The organic material may include atleast one of an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, or a perylene-basedresin. If the first touch insulation layer TS-IL1 insulates the firstand second touch insulation layers TS-IL1 and TS-IL2 from each other,exemplary embodiments may not be limited to a shape of the first touchinsulation layer TS-IL1. The first touch insulation layer TS-IL1 may bedeformed in shape according to shapes of the first and second conductivepatterns. The first touch insulation layer TS-IL1 may entirely cover thesecond display panel surface BS1-U that will be described later in moredetail or include a plurality of insulation patterns.

As illustrated in FIG. 10A, the first conductive layer TS-CL1 may bedisposed on the thin film encapsulation layer TFE. That is, the thinfilm encapsulation layer TFE provides the second display panel surfaceBS1-U on which the touch sensing layer TS is disposed.

The display panel layer DP1 of FIG. 10B may further include a bufferlayer BFL disposed on the thin film encapsulation layer TFE whencompared to the display panel layer DP of FIG. 10A. As such, the bufferlayer BFL provides the second display panel surface BS1-U. In one ormore exemplary embodiments, the buffer layer BFL may be an organic layerand formed of a different material according to the function to beperformed by the buffer layer BFL. The buffer layer BFL may be anorganic/inorganic layer that that matches a refraction index ofsurrounding layers or a color filter layer for reducing reflection ofexternal light.

Referring to FIG. 10C, the first conductive layer TS-CL1 may be disposedon the first display panel surface BS1-L. The first touch insulationlayer TS-IL1 is disposed on the first conductive layer TS-CL1, thesecond conductive layer TS-CL2 is disposed on the first touch insulationlayer TS-IL1, and the second touch insulation layer TS-IL2 is disposedon the second conductive layer TS-CL2.

FIGS. 11A and 11B are plan views illustrating the conductive layersTS-CL1 and TS-CL2 of the touch detection member TS, according to one ormore exemplary embodiments. FIG. 12A is a partial enlarged view of areaAA of FIG. 11A, according to one or more exemplary embodiments. FIGS.12B and 12C are partial cross-sectional views of FIG. 12A respectivelytaken along sectional lines I-I′ and II-II′, according to one or moreexemplary embodiments. FIG. 13A is a partial enlarged view of area BB ofFIG. 11B, according to one or more exemplary embodiments. FIGS. 13B and13C are partial cross-sectional views of FIG. 13A respectively takenalong sectional lines III-III′ and IV-IV′, according to one or moreexemplary embodiments. FIG. 14A is a partial enlarged view of area CC ofFIG. 11B, according to one or more exemplary embodiments. FIG. 14B is apartial cross-sectional view of FIG. 14A taken along cross-sectionalline V-V′, according to one or more exemplary embodiments. It is notedthat the touch sensing layer TS and the display panel layer DP of theconstituents of a display module will be mainly illustrated anddescribed in association with FIGS. 11A, 11B, 12A to 12C, 13A to 13C,14A, and 14B. To this end, the circuit layer DP-CL is schematicallyillustrated and will be described in association with FIGS. 12B, 12C,13B, 13C, and 14B.

According to one or more exemplary embodiments, a two-layer capacitivetouch detection member is illustrated as an example. A two-layercapacitive touch sensing layer may acquire coordinate information at atouched point (or a hovering touch interaction) in a self-capacitancemanner or a mutual capacitance manner. Exemplary embodiments, however,are not limited to or by the driving manner for acquiring the coordinateinformation. The first conductive patterns of FIG. 11A may correspond tothe first conductive layer TS-CL1 of FIGS. 10A to 10C, and the secondconductive patterns of FIG. 11B may correspond to the second conductivelayer TS-CL2 of FIGS. 10A to 10C.

As illustrated in FIG. 11A, the first conductive patterns may includefirst touch electrodes TE1-1 to TE1-3 and first touch signal lines SL1-1to SL1-3. Three first touch electrodes TE1-1 to TE1-3 and three firsttouch signal lines SL1-1 to SL1-3 respectively connected to the threefirst touch electrodes TE1-1 to TE1-3 are illustrated in FIG. 11A. It iscontemplated, however, that any suitable number of first touchelectrodes and first touch signal lines may be utilized in associationwith exemplary embodiments described herein.

The first touch electrodes TE1-1 to TE1-3 extend in the first directionDR1 and are arranged in the second direction DR2. Each of the firsttouch electrodes TE1-1 to TE1-3 may have a mesh shape in which aplurality of touch openings are defined. The mesh shape will bedescribed later in more detail. Each of the first touch electrodes TE1-1to TE1-3 includes a plurality of first sensing parts SP1 and a pluralityof first connection parts CP1. The first sensing parts SP1 are arrangedin the first direction DR1. Each of the first connection parts CP1connects two first sensing parts SP1, which are adjacent to each other,of the first sensing parts SP1. Although not illustrated, each of thefirst touch signal lines SL1-1 or SL1-3 may also have a mesh shape. Thefirst touch signal lines SL1-1 to SL1-3 may have the same layeredstructure as the first touch electrodes TE1-1 to TE1-3.

Referring to FIG. 11B, the second conductive patterns may include secondtouch electrodes TE2-1 to TE2-3 and second touch signal lines SL2-1 toSL2-3. Three second touch electrodes TE2-1 to TE2-3 and three secondtouch signal lines SL2-1 to SL2-3 respectively connected to the threesecond touch electrodes TE2-1 to TE2-3 are illustrated in FIG. 11B. Itis contemplated, however, that any suitable number of second touchelectrodes and second touch signal lines may be utilized in associationwith exemplary embodiments described herein. The second touch electrodesTE2-1 to TE2-3 are insulated from the first touch electrodes TE1-1 toTE1-3 and cross the first touch electrodes TE1-1 to TE1-3. Each of thesecond touch electrodes TE2-1 to TE2-3 may have a mesh shape in which aplurality of touch openings are defined.

Each of the second touch electrodes TE2-1 to TE2-3 includes a pluralityof second sensing parts SP2 and a plurality of second connection partsCP2. The second sensing parts SP2 are arranged in the second directionDR2. Each of the second connection parts CP2 connects two second sensingparts SP2, which are adjacent to each other, of the second sensing partsSP2. Although not illustrated, each of the second touch signal linesSL2-1 or SL2-3 may also have a mesh shape. The second touch signal linesSL2-1 to SL2-3 may have the same layered structure as the second touchelectrodes TE2-1 to TE2-3.

According to one or more exemplary embodiments, the first touchelectrodes TE1-1 to TE1-3 and the second touch electrodes TE2-1 andTE2-3 are capacitively coupled to each other. Since touch detectionsignals are applied to the first touch electrodes TE1-1 to TE1-3,capacitors are formed (or disposed) between the first sensing parts SP1and the second sensing parts SP2. The shapes of the first touchelectrodes TE1-1 to TE1-3 and the second touch electrodes TE2-1 to TE2-3that include the respective sensing parts and the respective connectionparts of FIGS. 11A to 11B are merely examples, and, as such, exemplaryembodiments are not limited thereto or thereby. For example, theconnection parts may only be defined as portions at which the firsttouch electrodes TE1-1 to TE1-3 and the second touch electrodes TE2-1 toTE2-3 cross each other, and the sensing parts may only be defined asportions at which the first touch electrodes TE1-1 to TE1-3 and thesecond touch electrodes TE2-1 to TE2-3 overlap each other. In one ormore exemplary embodiments, each of the first touch electrodes TE1-1 toTE1-3 and the second touch electrodes TE2-1 to TE2-3 may have a barshape having a determined width.

As illustrated in FIG. 12A, the first sensing parts SP1 overlap with thenon-light emitting area NPXA. The first sensing parts SP1 include aplurality of first vertical portions SP1-C extending in the firstdirection DR1 and a plurality of first horizontal portions SP1-Lextending in the second direction DR2. The plurality of first verticalportions SP1-C and the plurality of first horizontal portions SP1-L maybe defined as mesh lines. Each of the mesh lines may have a line widthof several micrometers.

The plurality of first vertical portions SP1-C and the plurality offirst horizontal portions SP1-L may be connected to each other to definea plurality of touch openings TS-OP. That is, the first sensing partsSP1 may have a mesh shape having the plurality of touch openings TS-OP.Although the structure in which the touch openings TS-OP are shown ashaving one-to-one correspondence with the light emitting areas PXA,exemplary embodiments are not limited thereto or thereby. For instance,a touch opening TS-OP may correspond to two or more light emitting areasPXA.

As illustrated in FIGS. 12B and 12C, the first touch insulation layerTS-IL1 overlaps with the display area DA and the non-display area NDA.The first touch insulation layer TS-IL1 is disposed on the seconddisplay panel surface BS1-U to cover the first sensing part SP1 (thefirst horizontal portions SP1-L are shown in FIG. 12B as being coveredby the first touch insulation layer TS-IL1). Although not separatelyshown, the first touch insulation layer TS-IL1 may cover the firstconnection parts CP1 and the first touch signal lines SL1-1 to SL1-3. Inone or more exemplary embodiments, the second display panel surfaceBS1-U is provided by the thin film encapsulation layer TFE. The secondtouch insulation layer TS-IL2 is disposed on the first touch insulationlayer TS-IL1 to overlap with the display area DA and the non-displayarea NDA. The second touch insulation layer TS-IL2 provides the firstbase surface BS2.

Referring to FIGS. 13A to 13C, the second sensing parts SP2 are disposedon the first touch insulation layer TS-IL1. The second sensing parts SP2overlap the non-light emitting area NPXA. The second sensing parts SP2include a plurality of second vertical portions SP2-C extending in thefirst direction DR1 and a plurality of second horizontal portions SP2-Lextending in the second direction DR2. The plurality of second verticalportions SP2-C and the plurality of second horizontal portions SP2-L maybe connected to each other to define a plurality of touch openingsTS-OP. That is, the second sensing parts SP2 have a mesh shape. Thesecond touch insulation layer TS-IL2 is disposed on the first touchinsulation layer TS-IL1 to cover the second sensing parts SP2. As seenin FIG. 13B, the second vertical portions SP2-C are shown as beingcovered by the second touch insulation layer TS-IL2. Although notseparately shown, the second touch insulation layer TS-IL2 may cover thesecond connection parts CP2 and the second touch signal lines SL2-1 toSL2-3.

FIG. 14 illustrates an overlapping portion of the conductive layers ofFIGS. 11A and 11B. As illustrated in FIGS. 14A and 14B, the firstconnection part CP1 may include third vertical portions CP1-C1 andCP1-C2 disposed on the thin film encapsulation layer TFE and thirdhorizontal portions CP1-L connecting the third vertical portions CP1-C1and CP1-C2 to each other. Although two third vertical portions CP1-C1and CP1-C2 are illustrated, exemplary embodiments are not limitedthereto or thereby. The second connection parts CP2 may include fourthhorizontal portions CP2-L1 and CP2-L2 disposed on the first touchinsulation layer TS-IL1 and fourth vertical portions CP2-C connectingthe fourth horizontal portions CP2-L1 and CP2-L2 to each other. Thefirst connection parts CP1 may have a mesh shape, and the secondconnection parts CP2 may also have a mesh shape. Although two fourthhorizontal portions CP2-L1 and CP2-L2 are illustrated, exemplaryembodiments are not limited thereto or thereby.

As described above, since each of the first touch electrodes TE1-1 toTE1-3 and the second touch electrodes TE2-1 to TE2-3 has a mesh shape,and the plurality of touch openings are defined in the first and secondinsulation layers TS-IL1 and TS-IL2, the flexible display device DD maybe improved in flexibility. When the flexible display device DD is bent,tension stress/compression stress applied to the first touch electrodesTE1-1 to TE1-3 and the second touch electrodes TE2-1 to TE2-3 may bereduced, which may prevent (or at least reduce) the potential of thetouch electrodes from being cracked.

FIGS. 15A and 15B are plan views illustrating conductive layers of atouch detection member, according to one or more exemplary embodiments.FIG. 15C is a partial enlarged view of area CC in FIG. 15B, according toone or more exemplary embodiments. FIG. 15D is a partial cross-sectionalview of FIG. 15C taken along sectional line VI-VI′, according to one ormore exemplary embodiments. It is noted that the circuit layer DP-CL isillustrated in FIG. 15D. Further, it is noted that the structuresillustrated in FIGS. 15A to 15D are similar to the structures of FIGS.11A, 11B, 14A, and 14B, and, as such, duplicative descriptions have beenomitted to avoid obscuring exemplary embodiments described herein. Inthis manner, differences are primarily described below.

According to one or more exemplary embodiments, a single layercapacitive touch detection member is illustrated. The single layercapacitive touch detection member may be driven in a self-capacitancemanner. It is contemplated, however, that exemplary embodiments are notlimited to or by the driving manner to acquire the coordinateinformation associated with touch event detection. In one or moreexemplary embodiments, the first conductive patterns of FIG. 15A maycorrespond to the first conductive layer TS-CL1 of FIGS. 10A to 10C, andthe second conductive patterns of FIG. 15B may correspond to the secondconductive layer TS-CL2 of FIGS. 10A to 10C. In one or more exemplaryembodiments, the first conductive patterns of FIG. 15A may correspond tothe second conductive layer TS-CL2 of FIGS. 10A to 10C, and the secondconductive patterns of FIG. 15B may correspond to the first conductivelayer TS-CL1 of FIGS. 10A to 10C.

As illustrated in FIG. 15A, the first conductive patterns may includefirst touch electrodes TE1-1 to TE1-3, first touch signal lines SL1-1 toSL1-3, second sensing parts SP2′ of second touch electrodes TE2-1′ toTE2-3′, and second touch signal lines SL2-1 to SL2-3. Each of the firsttouch electrodes TE1-1 to TE1-3 includes a plurality of first sensingparts SP1 and a plurality of first connection parts CP1. As illustratedin FIG. 15B, the second conductive patterns may include a plurality ofsecond connection parts CP2′ of the second touch electrodes TE2-1′ toTE2-3′. Each of the second connection parts CP2′ may have a bridgefunction.

Referring to FIGS. 15C and 15D, the second connection parts CP2′electrically connect two second sensing parts SP2′, which are adjacentto each other in the second direction DR2, of the second sensing partsSP2′ through first and second through holes TS-CH1 and TS-CH2 passingthrough the first touch insulation layer TS-IL1. In one or moreexemplary embodiments, the plane of the first touch insulation layerTS-IL1 may be changed in shape. The first touch insulation layer TS-IL1may not cover the entire display area DA. For instance, the first touchinsulation layer TS-IL1 may only overlap the plurality of secondconnection parts CP2′ of FIG. 15B. Also, the first touch insulationlayer TS-IL1 may include a plurality of insulation patterns disposed tocorrespond to the plurality of second connection parts CP2′.

The conductive patterns of the touch detection member TS, according toone or more exemplary embodiments, are illustrated in FIGS. 11A to 15D.The exemplary embodiments of the touch detection member TS are notlimited to or by the constituents of the touch detection member TSillustrated in FIGS. 11A to 15D. For instance, the touch detectionmember TS may further include a noise shield pattern for reducing noiseand dummy patterns for improving optical balance.

FIGS. 16A, 16B, 16C, 16D, 16E, 16F, and 16G are cross-sectional views ofdisplay devices, according to one or more exemplary embodiments. It isnoted that the display member DM, the second adhesion member AM2, andthe window member WM of the various constituents of the display devicesare illustrated. The display devices of FIGS. 16A to 16G are similar tothe display devices of FIGS. 1A to 15D, and, as such, duplicativedescriptions will be omitted to avoid obscuring exemplary embodimentsdescribed herein. In this manner, primarily differences will bedescribed below.

FIGS. 16A and 16B are cross-sectional views respectively taken alongsectional lines I-I′ of FIG. 12A and sectional line II-II′ of FIG. 12C.The reflection prevention layer RPL is disposed on the first basesurface BS2. The reflection prevention layer RPL includes black matrixesBM-P1 and BM-P2 and color filters CF. The black matrixes BM-P1 and BM-P2overlap with the non-light emitting area NPXA and the non-display areaNDA, and the color filters CF respectively overlap with the lightemitting areas PXA. The black matrixes BM-P1 and BM-P2 and the colorfilters CF may define a second base surface BS3.

In one or more exemplary embodiments, the color filters CF may includeplural groups of color filters. For example, the color filters CF mayinclude red color filters, green color filters, and blue color filters.The color filters CF may include a gray filter. It is contemplated,however, that any suitable color for a color filter CF may be utilizedin association with exemplary embodiments described herein.

The black matrixes BM-P1 and BM-P2 may be formed of a material that iscapable of blocking light. The black matrixes BM-P1 and BM-P2 mayprevent light emitted from the organic light emitting devices OLED frombeing mixed with each other and absorb light (hereinafter, referred toas external light) incident from the outside. For example, each of theblack matrixes BM-P1 and BM-P2 may be formed of an organic materialhaving relatively high light absorption. Each of the black matrixesBM-P1 and BM-P2 may include a black pigment or a black dye. Each of theblack matrixes BM-P1 and BM-P2 may include a photosensitive organicmaterial, e.g., a coloring, such as a pigment or a dye. Each of theblack matrixes BM-P1 and BM-P2 may have a single or multi-layerstructure.

The color filters CF may transmit light emitted from the organic lightemitting devices OLED and reduce a reflective index of the externallight. The external light may pass through the color filters CF, and, assuch, may be reduced in intensity by about ⅓. A portion of light passingthrough the color filters CF may be dissipated, and a portion of thelight that is reflected by the constituents of the display devicedisposed under the color filters CF, e.g., the organic light emittingdevice layer DP-OLED and the thin film encapsulation layer TFE. Thereflected light may be incident again into the color filters CF. Thereflected light is reduced in brightness (or intensity) while passingthrough the color filters CF. In this manner, only a portion of theexternal light may be reflected from the display device. That is, theexternal light is reduced in reflectance.

The black matrixes BM-P1 and BM-P2 include a light shield portion BM-P1overlapping with the non-light emitting area NPXA and a bezel portionBM-P2 overlapping with the non-display area NDA. The light shieldportion BM-P1 has a first thickness TH1, and the bezel portion BM-P2 hasa second thickness TH2 greater than the first thickness TH1. The bezelportion BM-P2 has a light shield efficiency greater than that of thelight shield portion BM-P1. The light shield portion BM-P1 may only tohave a thickness that is enough to prevent colors of light generatedfrom the light emitting areas PXA from being mixed with each other. Thebezel portion BM-P2, however, may have a higher light shield ratio sothat the first touch signal lines SL1-1 to SL1-3 (see FIG. 11A) and thesecond touch signal lines SL2-1 to SL2-3 (see FIG. 11B) are notrecognized (or otherwise perceived) by a user. In this manner, the bezelportion BM-P2 may have a thickness greater than that of the light shieldportion BM-P1.

According to one or more exemplary embodiments, the light shield portionBM-P1 and the bezel portion BM-P2 may be integrated with each other. Apre-black matrix layer may be formed on the first base surface BS2 andpatterned to remove areas in which the color filters CF will be formed,as well as partially removed in an area in which the light shieldportion BM-P1 will be formed versus the bezel portion BM-P2. Thepre-black matrix layer may be gradually reduced in thickness accordingto various areas to form an integrated black matrix having thicknessesdifferent from each other in the various areas. It is contemplated,however, that exemplary embodiments are not limited thereto or thereby.For example, the light shield portion BM-P1 and the bezel portion BM-P2may have the same thickness as each other.

The second adhesion member AM2 is disposed directly on the second basesurface BS3. The second adhesion member AM2 is coupled to the secondbase surface BS3 through the second adhesion surface AS2.

The window member WM includes a base film WBF, a hard coating layerWHCL, and a functional coating layer HFL. In one or more exemplaryembodiments, the base film WBF may be coupled to the second adhesionsurface AS2 of the second adhesion member AM2. The base film WBF may bea plastic film formed of at least one of a polyimide-based resin, anacrylic-based resin, a methacrylic-based resin, a polyisoprene-basedresin, a vinyl-based resin, an epoxy-based resin, a urethane-basedresin, a cellulose-based resin, and a perylene-based resin. A materialforming the base film WBF is not limited to plastic resins. For example,the base film WBF may be formed of an organic/inorganic compositematerial. The base film WBF may include a porous organic layer and aninorganic material that is filled into pores of the organic layer.

The hard coating layer WHCL increases hardness of the window member WM.The hard coating layer WHCL may include a silicon-based polymer. It iscontemplated, however, that exemplary embodiments are not limited to orby the material for the hard coating layer, but may include any suitablehard coating material. Although not shown, the function coating layerHFL may include a fingerprint layer, a reflection prevention layer, anda self-restoring layer. In one or more exemplary embodiments, one of thehard coating layer WHCL and the functional coating layer HFL may beomitted or provided in plurality. It is also contemplated that the basefilm WBF, the hard coating layer WHCL, and the functional coating layerHFL may be changed in stacking order.

According to one or more exemplary embodiments, each of the hard coatinglayer WHCL and the functional coating layer HFL may be formed on thebase film WBF in a coating or printing manner. It is also contemplatedthat each of the hard coating layer WHCL and the functional coatinglayer HFL may be formed through roll coating, silkscreen coating, spraycoating, and/or slit coating.

FIGS. 16C to 16E are cross-sectional views taken along sectional lineII-II′ of FIG. 12A, according to one or more exemplary embodiments. Thedisplay devices of FIGS. 16C to 16E are similar to the display devicesof FIGS. 16A to 16B, and, as such, duplicative descriptions will beomitted to avoid obscuring exemplary embodiments described herein. Inthis manner, primarily differences will be described below. Forinstance, differences between the reflection prevention layers of FIGS.16C to 16E and the reflection prevention layer of FIGS. 16A and 16B willbe mainly described.

As illustrated in FIG. 16C, the bezel portion BM-P2′ may include aplurality of layers. FIG. 16C illustrates an example of the bezelportion BM-P2′ having a three-layer structure. The lowermost layer ofthe plurality of layers may have a shape that is integrated with thelight shield portion BM-P1. The first preliminary layer may be formedand then patterned to form a first layer (the lowermost layer). A secondpreliminary layer and a third preliminary layer may be formed and thenpatterned to successively form a second layer and a third layer. Thefirst to third preliminary layers may be successively formed and thendifferently patterned according to the areas to form the bezel portionBM-P2′ having the three-layer structure and the light shield portionBM-P1 having the single-layer structure.

According to one or more exemplary embodiments, the first to thirdlayers may be formed of the same material or materials different fromeach other. The first layer may include a black pigment or black dye,and each of the second and third layers may include a colored pigment ordye having a color different from the black color. The second and thirdlayer may include a pigment or dye having the same color as one another.The second layer may be a decoration layer that provides a geometricpattern, such as a hair line or a weaving pattern. The decoration layermay increase the aesthetic appeal of the display device. The third layermay be an optical layer capable of adjusting reflectance or a reflectionwavelength of the external light.

Referring to FIG. 16D, the black matrixes BM-P1′ and BM-P2″ overlap witha non-light emitting area NPXA, and color filters CF′ respectivelyoverlap with light emitting areas PXA. The color filters CF′ maypartially overlap with the non-light emitting area NPXA. The colorfilters CF′ may be disposed on the first base surface BS2, and, then,the black matrixes BM-P1′ and BM-P2″ may be formed. The color filtersCF′ and the black matrixes BM-P1′ and BM-P2″ may be formed through aphotolithographic process. Each of the black matrixes BM-P1′ and BM-P2″may have a height greater than that of each of the color filters CF′.

Adverting to FIG. 16E, the black matrixes BM-P1″ and BM-P2′″ overlapwith a non-light emitting area NPXA, and color filters CF″ respectivelyoverlap with light emitting areas PXA. The color filters CF″ maypartially overlap with the non-light emitting area NPXA. The blackmatrixes BM-P1″ and BM-P2′″ may be disposed on the first base surfaceBS2, and, then, the color filters CF″ may be formed. Each of the colorfilters CF″ may have a height greater than that of each of the blackmatrixes BM-P1″ and BM-P2′″.

As illustrated in FIGS. 16D and 16E, each of the light shield portionsBM-P1′ and BM-P1″ and the bezel portions BM-P2″ and BM-P2′″ may have aninclined side surface. The light shield portions BM-P1′ and BM-P1″include first side surfaces SS1 and SS1′ facing each other in the firstdirection DR1. The bezel portions BM-P2″ and BM-P2′″ include inclinedsecond side surfaces SS2 and SS2′. Since the black matrix is directlyformed on the second base surface BS2 through photolithographicprocesses, the side surfaces SS1, SS1′, SS2, and SS2″ may be inclined.The side surfaces SS1, SS1′, SS2, and SS2′ may be changed in shapeaccording to the manufacturing order of the black matrixes BM-P1′,BM-P1″, BM-P2″, and BM-P2′″ and the color filters CF′ and CF″.

As illustrated in FIG. 16D, portions of the side surfaces SS1 and SS2,which are exposed from the color filters CF′, may be inclined. Unlikethe drawings, the inclinations of the exposed portions of the sidesurfaces SS1 and SS2 may be different from each other. Referring to FIG.16E, the side surfaces SS1′ and SS2′ may have the same inclination as awhole. It is noted, however, that although the side surfaces SS1′ andSS2′ are shown with a uniform inclination, this is a merely an example.In one or more exemplary embodiments, the inclinations of the sidesurfaces SS1′ and SS2′ may be different from each other.

As illustrated in FIGS. 16D and 16E, a bottom surface (a surfacecontacting the second touch insulation layer TS-IL2) of each of thelight shield portions BM-P1′ and BM-P1″ and the bezel portions BM-P2″and BM-P2′″ may have a width greater than that of a top surface (theother surface opposing the surface contacting the second touchinsulation layer TS-IL2) thereof. The width is measured in the firstdirection DR1.

FIGS. 16F and 16G are cross-sectional views taken along sectional lineII-II′ of FIG. 12A, according to one or more exemplary embodiments. Thedisplay devices of FIGS. 16F and 16G are similar to the display devicesof FIGS. 16A to 16E, and, as such, duplicative descriptions will beomitted to avoid obscuring exemplary embodiments described herein. Inthis manner, primarily differences will be described below. Forinstance, differences between the window members and the reflectionprevention layers of FIGS. 16F and 16G and the window member andreflection prevention layer of FIGS. 16A to 16E will be mainlydescribed.

As illustrated in FIG. 16F, the light shield portion BM-P1′ and thebezel portion BM-P2′″ have the same thickness as one another. The windowmember WM′ may further include an edge black matrix WBM disposeddirectly on the second adhesion surface AS2′. The edge black matrix WBMmay overlap the non-display area NDA. The edge black matrix WBM maysupplement the bezel portion BM-P2′″ to reduce reflectance of theexternal light on the non-display area NDA.

Referring to FIG. 16G, the bezel portion BM-P2 may be omitted. Here, theedge black matrix WBM′ may have a greater thickness than in FIG. 16F. Itis contemplated, however, that exemplary embodiments are not limited toor by the layer structure and shape of the edge black matrix WBM′. Forexample, the edge matrix WBM′ may have the same layer structure andshape as those of the bezel portions described with reference to FIGS.16A to 16E.

FIGS. 17A to 17D are cross-sectional views of display devices, accordingto one or more exemplary embodiments. The display devices of FIGS. 17Ato 17D are similar to the display devices of FIGS. 1A to 16G, and, assuch, duplicative descriptions will be omitted to avoid obscuringexemplary embodiments described herein. In this manner, primarilydifferences will be described below. It is noted that FIGS. 17A and 17Care cross-sectional views taken along sectional line I-I′ of FIG. 12A,whereas FIGS. 17B and 17D are cross-sectional views taken alongsectional line II-II′ of FIG. 12A. The display member DM, the secondadhesion member AM2, and the window member WM of the variousconstituents of the display devices are illustrated. For illustrativeand descriptive convenience, the window member WM is illustrated as asingle layer.

As illustrated in FIGS. 17A and 17B, the reflection prevention layer RPLmay include first and second metal-containing layers ML1 and ML2, eachof which respectively overlaps with the display area DA and thenon-display area NDA, and first and second dielectric layers IL1 andIL2, each of which respectively overlaps with the display area DA andthe non-display area NDA. The reflection prevention layer RPL includingfirst and second metal-containing layers ML1 and ML2 and first andsecond dielectric layers IL1 and IL2 are illustrated as merely anexample. It is contemplated that any suitable number of metal-containinglayers and any suitable number of dielectric layers may be utilized inassociation with exemplary embodiments described herein.

According to one or more exemplary embodiments, the first and secondmetal-containing layers ML1 and ML2 and the first and second dielectriclayers IL1 and IL2 are alternately stacked with respect to each other.Exemplary embodiments, however, are not limited to the illustratedstacking order. The first metal-containing layer ML1 may include a metalhaving an absorption rate of about 30% or more. The firstmetal-containing layer ML1 may be formed of a material having arefractive index of about 1.5 to about 7, and an absorption coefficientk of about 1.5 to about 7. The first metal-containing layer ML1 may beformed of at least one of chrome (Cr), molybdenum (Mo), tungsten (W),titanium (Ti), nickel (Ni), cobalt (Co), copper oxide (CuO), nitridedtitanium (TiNx), and nickel sulfide (NiS). The first metal-containinglayer ML1 may be a metal layer formed of one or more of theaforementioned materials, as may the second metal-containing layer ML2.

In one or more exemplary embodiments, each of the first dielectric layerIL1 and the second dielectric layer IL2 may be formed of one selectedfrom the group consisting of silicon dioxide (SiO₂), titanium dioxide(TiO₂), lithium fluoride (LiF), calcium fluoride (CaF₂), magnesiumfluoride (MaF₂), silicon nitride (SiN_(x)), tantalum oxide (Ta₂O₅),niobium oxide (Nb₂O₅), silicon carbon nitride (SiCN), molybdenum oxide(MoOx), iron oxide (FeO_(x)), and chromium oxide (CrO_(x)). Light OLincident from the outside is partially reflected by the firstmetal-containing layer ML1 (hereinafter, referred to as first reflectedlight RL1) and the second metal-containing layer ML2 (hereinafter,referred to as second reflected light RL2).

The first dielectric layer IL1 may adjust a phase of light passingthrough the first dielectric layer IL1 so that the first reflected layerRL1 and the second reflected light RL2 have a phase difference of about180° therebetween. In this manner, the first reflected light RL1 and thesecond reflected light RL2 may be destructively combined. As such, thefirst metal-containing layer ML1, the second metal-containing layer ML2,the first dielectric layer IL1, and the second dielectric layer IL2 maybe selected in thickness and material to satisfy conditions fordestructive interference between the first reflected light RL1 and thesecond reflected light RL2. Exemplary embodiments, however, are notlimited thereto or thereby.

As illustrated in FIGS. 17C and 17D, the reflection prevention layerRPL′″ may further include black matrixes BM-P1″ and BM-P2′″. Althoughthe black matrix having the same shape as each of the black matrixesBM-P1″ and BM-P2′″ described with reference to FIG. 16E is illustrated,exemplary embodiments are not limited to the shape, thickness, and/orstacked structure of each of the black matrixes BM-P1″ and BM-P2′″. Itis noted, however, that the shape and configuration of the first andsecond metal layers ML1′ and ML2′ and the shape and configuration of thefirst and second dielectric layer IL1′ and IL2′ may be configured basedon the configuration of the black matrixes BM-P1″ and BM-P2′″. Althoughnot separately shown, the window member and the black matrixes of FIGS.17C and 17D may be formed in shape and configuration as illustrated inFIGS. 16F and 16G.

FIGS. 18A to 18F are cross-sectional views of display devices of FIG.12A taken along sectional line I-I′, according to one or more exemplaryembodiments. The display devices of FIGS. 18A to 18F are similar to thedisplay devices of FIGS. 1A to 17D, and, as such, duplicativedescriptions will be omitted to avoid obscuring exemplary embodimentsdescribed herein. In this manner, primarily differences will bedescribed below. It is noted that the display member DM, the secondadhesion member AM2, and the window member WM of the variousconstituents of the display devices are illustrated. For illustrativeand descriptive convenience, the window member WM is illustrated as asingle layer.

According to one or more exemplary embodiments, the display devicesillustrated in FIGS. 18A to 18F may be examples of the display device ofFIG. 4C. The touch sensing layer TS-R may detect an external input andreduce the reflection of the external light. As described below, thesefeatures are achieved, at least in part, by the touch sensing layer TS-Rincluding color filters.

As illustrated in FIG. 18A, the first touch insulation layer TS-IL1 isdisposed on the second display panel surface BS1-U. A plurality of firstinsulation openings IL1-OP corresponding to the plurality of lightemitting areas PXA are defined in the first touch insulation layerTS-IL1, respectively. The color filters CF″″ may be disposed in theplurality of first insulation openings IL1-OP. Colors of the colorfilters CF″″ may be differently selected for the first insulationopenings IL1-OP in consideration of colors of light emitted from theorganic light emitting devices OLED. For example, red color filters maybe disposed to overlap the organic light emitting devices OLED that emitred light, green color filters may be disposed to overlap the organiclight emitting devices OLED that emit green light, and blue colorfilters may be disposed to overlap the organic light emitting devicesOLED that emit blue light. It is noted, however, that any suitable colorfor a color filter may be utilized in association with exemplaryembodiments described herein.

The color filters CF″″ may transmit light emitted from the organic lightemitting devices OLED and reduce a reflective index of external light.Also, the external light may pass through the color filters CF″″, and,as such, be reduced in intensity by about ⅓. A portion of the lightpassing through the color filters CF″″ may be dissipated, and a portionof the light may be reflected by the organic light emitting device layerDP-OLED and the thin film encapsulation layer TFE. The reflected lightmay be incident to the color filters CF″″. The reflected light isreduced in intensity (e.g., brightness) while passing through the colorfilters CF″″. As a result, only a portion of the external light may bereflected from the display device.

In one or more exemplary embodiments, the first touch insulation layerTS-IL1 and the color filters CF″″ may be provided as one layer. Further,in one or more exemplary embodiments, the first touch insulation layerTS-IL1 may correspond to the black matrix that is described withreference to FIGS. 16B and 16C.

The second touch insulation layer TS-IL2 is disposed on the first touchinsulation layer TS-IL1. A plurality of second insulation openingsIL2-OP corresponding to the plurality of light emitting areas PXA aredefined in the second touch insulation layer TS-IL2. The second touchinsulation layer TS-IL2 and the color filters CF″″ may provide a firstbase surface BS2 having a stepped shape. Although not separately shown,the touch sensing layer TS-R may further include an insulation layerthat provides a first base surface BS2.

According to one or more exemplary embodiments, the first touchinsulation layer TS-IL1 and the second touch insulation layer TS-IL2 maybe successively stacked, and, then, the first insulation openings IL1-OPand the second insulation openings IL2-OP, which correspond to eachother, may be formed at the same time through one process. Once thefirst insulation openings IL1-OP and the second insulation openingsIL2-OP are formed, the color filters CF″″ may be formed. The colorfilters CF″″ may be formed using a printing manner, such as an inkjetprinting or a photolithographic manner.

Although a cross-section of the display device taken along sectionalline II-II′ of FIG. 12A is not illustrated, the display device may bethe same as that of FIG. 12C or further include the black matrixes BM-P1and BM-P2 disposed on the non-display area NDA. Further, although across-section taken along sectional line III-III′ of FIG. 13A is notillustrated, the display device may be the same as that of FIG. 18Aexcept for a position of the sensing part.

As illustrated in FIG. 18B, the second touch insulation layer TS-IL2′ isdisposed on the first touch insulation layer TS-IL1. Unlike in FIG. 18A,the plurality of second insulation openings IL2-OP are not provided inthe second touch insulation layer TS-IL2′. The second touch insulationlayer TS-IL2′ provides the first base surface BS2′.

Referring to FIG. 18C, the color filters CF′″″ may be disposed at thesame time in the first and second insulation openings IL1-OP and IL2-OP.Since the first and second insulation openings IL1-OP and IL2-OP areformed at the same time, the first insulation opening IL1-OP and thesecond insulation opening IL2-OP may be aligned with each other. Thecolor filters CF′″″ may extend from the inside of the first insulationopening IL1-OP to the inside of the second insulation opening IL2-OP.The color filters CF′″″ may have a thickness that is substantially thesame as the sum of thicknesses of the first touch insulation layerTS-IL1 and the second touch insulation layer TS-IL2″ in the thirddirection DR3. The second touch insulation layer TS-IL2″ and the colorfilters CF′″″ may provide a flat first base surface BS2″ upon which thewindow member WM is disposed.

Adverting to FIG. 18D, the black matrix BM may be disposed on the secondtouch insulation layer TS-IL2. A plurality of transmission openingsBM-OP corresponding to the light emitting areas PXA are defined in theblack matrix BM. The black matrix BM and the color filters CF″″ mayprovide a first base surface BS2′″ having a stepped shape. Although notillustrated, the black matrix BM may further cover an inner wall of eachof the first and second insulation openings IL1-OP and IL2-OP.

Although not shown, according to one or more exemplary embodiments, atleast one of the first and second touch insulation layers TS-IL1 andTS-IL2/TS-IL2′/TS-IL2″ of FIGS. 18A and 18C may be replaced with theblack matrix BM. The first touch insulation layer TS-IL1 of FIG. 18B maybe replaced with the black matrix BM.

As illustrated in FIG. 18E, the thin film encapsulation layer TFEprovides a second display panel surface BS1-U. The color filters CF″″″are disposed on the second display panel surface BS1-U. Each of thecolor filters CF″″″ may include a central portion CF-C and edge portionsCF-E. The central portion CF-C overlaps with the corresponding lightemitting area of the plurality of light emitting areas PXA. The edgeportions CF-E extend from the central portion CF-C and overlap with thenon-light emitting areas NPXA. For instance, the edge portion CF-E mayoverlap with the first conductive pattern, e.g., the first horizontalportion SP1-L of the first sensing part SP1. Although not separatelyshown, the color filters CF″″″ may also overlap the first connectionpart CP1. When each of the color filters CF″″″ is disposed on a plane,the edge portion CF-E may surround the central portion CF-C.

According to one or more exemplary embodiments, the edge portion CF-E ofeach of the color filters CF″″″ adjacent to each other may contact andcover the first horizontal portion SP1-L of the first sensing part SP1.The edge portions CF-E of the color filters CF″″″ adjacent to each othermay contact each other. The edge portions CF-E of the color filtersCF″″″ adjacent to each other may partially cover the first horizontalportion SP1-L to completely cover the first conductive pattern.

A black matrix TS-BM is disposed on the color filters CF″″″. Asillustrated in FIG. 18E, the black matrix TS-BM may be directly disposedon the color filters CF″″″. A plurality of transmission openings BM-OP′corresponding to the light emitting areas PXA are defined in the blackmatrix TS-BM. The black matrix TS-BM and the color filters CF″″″ mayprovide a first base surface BS2″″.

In one or more exemplary embodiments, the black matrix TS-BM may bedisposed to correspond to the non-light emitting areas NPXA. Theplurality of light emitting areas PXA and the plurality of transmissionopenings BM-OP′ may have the same shape on the plane. That is, the blackmatrix TS-BM has substantially the same shape as the non-light emittingareas NPXA (for example, the black matrix TS-BM has the same width asthe non-light emitting area NPXA in the first and second directions DR1and DR2). It is contemplated, however, that exemplary embodiments arenot limited thereto or thereby. For example, the plurality of lightemitting areas PXA and the plurality of transmission openings BM-OP' mayhave shapes different from each other.

Referring to FIG. 18F, the touch sensing layer TS-R′″″ includes a firstblack matrix TS-BM1 and a second black matrix TS-BM2. The first blackmatrix TS-BM1 is disposed on the second display panel surface BS1-U tocover the first conductive pattern, e.g., the first horizontal portionSP1-L of the first sensing part SP1. A plurality of first transmissionopenings BM1-OP corresponding to the light emitting areas PXA aredefined in the first black matrix TS-BM1. The edge portions CF-E′ of thecolor filters CF′″″″ adjacent to each other may contact and cover thefirst black matrix TS-BM1. The color filters CF′″″″ adjacent to eachother may completely cover the first black matrix TS-BM1.

The second black matrix TS-BM2 is disposed on the color filters CF′″″″.A plurality of second transmission openings BM2-OP corresponding to thelight emitting areas PXA are defined in the second black matrix TS-BM2.The second black matrix TS-BM2 and the color filters CF′″″″ may providea first base surface BS2′″″.

FIGS. 19A and 19B are cross-sectional views of a display device,according to one or more exemplary embodiments. FIGS. 20A and 20B arecross-sectional views of cathodes of organic light emitting diodes ofdisplay devices, according to one or more exemplary embodiments. It isnoted that FIG. 19A is a cross-sectional view of FIG. 12A taken alongsectional line I-I′, whereas FIG. 19B is a cross-sectional view of FIG.12A taken along sectional line II-II′, according to one or moreexemplary embodiments. The display devices of FIGS. 19A, 19B, 20A, and20B are similar to the display devices of FIGS. 1A to 18F, and, as such,duplicative descriptions will be omitted to avoid obscuring exemplaryembodiments described herein. In this manner, primarily differences willbe described below. It is noted that the display panel layer DP-R andthe touch sensing layer TS of the various constituents of the displaymember DM are illustrated.

It is noted that the display panel layer DP-R and the touch sensinglayer TS of the various constituents of the display device areillustrated. Further, the display devices illustrated in FIGS. 19A, 19B,20A, and 20B may be examples of the display device of FIG. 4D. Thedisplay panel layer DP-R may generate an image and reduce reflection ofexternal light. As described below, these features are achieved, atleast in part, by a cathode CE-R of the display panel layer DP-R thathas a function of a reflection prevention layer. The touch sensing layerTS of FIGS. 19A and 19B may be substantially the same as the touchsensing layer TS of FIGS. 12B and 12C. Although not shown, the firsttouch insulation layer TS-IL1 and the second touch insulation layerTS-IL2 may be formed as described with reference to FIGS. 18A to 18F.

As illustrated in FIG. 20A, the cathode CE-R may include a first metallayer CE-M1, a transparent conductive layer CE-M2 disposed on the firstmetal layer CE-M1, and a second metal layer CE-M3 disposed on thetransparent conductive layer CE-M2. The cathode CE-R having theaforementioned structure may receive a power voltage and reducereflectance of external light.

According to one or more exemplary embodiments, light OL incident fromthe outside is reflected by the first metal layer CE-M1, the transparentconductive layer CE-M2, and the second metal layer CE-M3. The lightreflected by the first metal layer CE-M1, the transparent conductivelayer CE-M2, and the second metal layer CE-M3 may be defined as a firstreflected light RL1, a second reflected light RL2, and a third reflectedlight RL3, respectively. In one or more exemplary embodiments, thesecond reflected light RL2 and the third reflected light RL3 maydestructively interfere with each other to reduce the reflectance of theexternal light OL. If the mixed light of the second reflected light RL2and the third reflected light RL3 has the same intensity as that of thefirst reflected light RL1 and a phase opposite to the first reflectedlight RL1 (e.g., a phase difference of about 180 degrees), destructiveinterference may occur.

The first metal layer CE-M1 may be formed of one selected form the groupconsisting of aluminum (Al), silver (Ag), magnesium (Mg), chromium (Cr),titanium (Ti), nickel (Ni), gold (Au), tantalum (Ta), copper (Cu),calcium (Ca), cobalt (Co), iron (Fe), molybdenum (Mo), tungsten (W),platinum (Pt), ytterbium (Yb), barium (Ba), and an alloy thereof. Sinceeach of the metals has relatively low resistance, the metals may beadequate for the first metal layer CE-M1 so as to efficiently transmitthe power voltage. Also, since each of the metals is relatively easy todeposit and relatively low reactivity with oxygen and moisture, themetals may be adequate for the first metal layer CE-M1. The first metallayer CE-M1 may have a thickness of about 50 nm to about 500 nm.

The transparent conductive layer CE-M2 may be formed of one selectedfrom the group consisting of indium tin oxide (ITO), aluminum zinc oxide(AZO), indium gallium oxide (IGO), gallium indium zinc oxide (GIZO),indium zinc oxide (IZO), zinc oxide (ZnO), and a mixture thereof. Thetransparent conductive layer CE-M2 may be formed of at least one of ametal and a dielectric material. The transparent conductive layer CE-M2generates a phase difference between the first reflected light RL1 andthe rest of the reflected light. The transparent conductive layer CE-M2may have a thickness that is selected so that destructive interferenceoccurs. Exemplary embodiments, however, are not limited thereto orthereby.

In one or more exemplary embodiments, destructive interference betweenthe third reflected light RL3 and the first reflected light RL1 occurs.To generate the destructive interference, the third reflected light RL3and the first reflected light RL1 may have phases opposite to each otherand the same size (or intensity) as each other. To generate effectivedestructive interference, the third reflected light RL3 and the firstreflected light RL1 may have sizes that are similar to each other.

The second metal layer CE-M3 may be a metal having relatively high lightabsorption. A metal having relatively high light absorption absorbslight that is not completely dissipated due to the destructiveinterference. The light absorption of the metal is proportional to amultiplication of a refractive index and an absorption coefficient. Inthis manner, if a metal has a large value of the multiplication of arefractive index and an absorption coefficient, the metal may besuitable for the material of the second metal layer CE-M3.

According to one or more exemplary embodiments, the second metal layerCE-M3 may be formed of chromium (Cr), titanium (Ti), magnesium (Mg),molybdenum (Mo), cobalt (Co), nickel (Ni), tungsten (W), aluminum (Al),silver (Ag), gold (Au), copper (Cu), iron (Fe), calcium (Ca), platinum(Pt), ytterbium (Yb), or an alloy thereof. The second metal layer CE-M3may have a thickness of about 1 nm to about 25 nm.

Adverting to FIG. 20B, the cathode CE-R′ may further include a thirdmetal layer CE-M4 disposed on the second metal layer CE-M3. Also, thecathode CE-R′ may be designed so that fourth reflected light RL4 that isreflected from the third metal layer CE-M4 destructively interferes withthe first reflected light RL1.

According to one or more exemplary embodiments, the third metal layerCE-M4 may have a work function so that electric charges (electrons) areeasily injected. When the third metal layer CE-M4 constitutes theuppermost layer of the cathode CE-R′, the third metal layer CE-M4 mayhave a relatively low reactivity with oxygen and moisture. The thirdmetal layer CE-M4 may be formed of a metal having a work function ofabout 4.6 eV or less or an alloy thereof. Alternatively, the third metallayer CE-M4 may be formed of a metal having a work function of about 3.7eV or less or an ally thereof. The third metal layer CE-M4 may be formedof one selected from the group consisting of ytterbium (Yb), calcium(Ca), aluminum (Al), silver (Ag), chromium (Cr), titanium (Ti),magnesium (Mg), lithium (Li), cesium (Cs), barium (Ba), potassium (K),and an alloy thereof. The third metal layer CE-M4 may have a thicknessof about 1 nm to about 15 nm.

Although the first metal layer CE-M1, the transparent conductive layerCE-M2, the second metal layer CE-M3, and the third metal layer CE-M4constitute the cathode CE-R′, exemplary embodiments are not limitedthereto or thereby. For example, the cathode CE-R′ may be provided inthe display panel layer DP to perform only the reflection preventionfunction, unlike the cathode CE.

According to one or more exemplary embodiments, the touch detectionmember, the reflection prevention member, the window member, and theprotection member may be integrated with the display panel as the touchsensing layer, the reflection prevention layer, the window layer, andthe external protection layer. Since the touch sensing layer, thereflection prevention layer, the window layer, and the externalprotection layer are formed through a continuous process, one or moreadhesion members, such as one or more OCA layers, or one or moreadhesion layers, such as one or more OCR layers may be omitted. Sincethe adhesive member(s) are omitted, the display device may be reduced inthickness, which may also improve the flexibility and aesthetic appealof the display device.

According to one or more exemplary embodiments, a touch detection memberand a reflection prevention member may be integrated with a displaypanel as a touch sensing layer and a reflection prevention layer. Inthis manner, the display device may be thinner than a conventionaldisplay device with a touch detection member and a reflection preventionmember that may be coupled to the display device using an adhesive.Also, the number of adhesion members may be minimized (or at leastreduced). Since the display device is decreased in thickness, eventhough the display device is repeatedly bent (or otherwise flexed), adelamination defect of the adhesion member(s) may be reduced. Also,since the display device is decreased in thickness, the display devicemay be bent (or otherwise flexed) at a smaller radius of curvature.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present invention. Thus,it is intended that the present disclosure covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A flexible display device comprising: aprotection component; a window; a display component disposed between theprotection component and the window, the display component comprising aplurality of light emitting areas and a non-light emitting area adjacentto the plurality of light emitting areas; a first adhesion layer tocouple the display component to the protection component; and a secondadhesion layer to couple the display component to the window, whereinthe display component comprises: a display panel comprising a firstsurface and a second surface opposing the first surface; and a touchsensing layer directly disposed on the second surface without anadhesive layer therebetween and comprising a third surface contactingthe second surface and a fourth surface opposing the third surface, andwherein: a thickness of the display component between the first surfaceand the fourth surface is about 30 μm to about 50 μm and is less than asum of thicknesses of the protection component and the window; thedisplay panel comprises a base layer providing the first surface and anuppermost inorganic layer providing the second surface; and the touchsensing layer comprises an uppermost insulating layer providing thefourth surface.
 2. The flexible display device of claim 1, wherein: thedisplay panel further comprises a light emitting diode disposed betweenthe uppermost inorganic layer and the base layer; and the touch sensinglayer further comprises a lowermost insulating layer providing the thirdsurface and a conductive pattern disposed between the uppermostinsulating layer and the lowermost insulating layer.
 3. The flexibledisplay device of claim 2, wherein the display panel further comprisesan inorganic layer and an organic layer to seal the light emittingdiode.
 4. The flexible display device of claim 2, wherein the protectioncomponent is thicker than the base layer.
 5. The flexible display deviceof claim 1, wherein a ratio between the thickness of the displaycomponent and the sum of thicknesses of the protection component and thewindow is about 1:1.2 to about 1:4.
 6. The flexible display device ofclaim 5, wherein a ratio between thicknesses of the protection componentand the window is about 5:3 to about 3:7.
 7. The flexible display deviceof claim 6, wherein a ratio between thicknesses of the first and secondadhesion layers corresponds to the ratio between thicknesses of theprotection component and the window.
 8. The flexible display device ofclaim 1, wherein the window comprises: a base film disposed on thesecond adhesion layer; and a hard coating layer disposed on the basefilm.
 9. The flexible display device of claim 8, wherein the windowfurther comprises: a functional coating layer disposed on the base film.10. The flexible display device of claim 8, wherein the window furthercomprises: a black matrix disposed on the base film, the black matrixnon-overlapping with the plurality of light emitting areas.
 11. Theflexible display device of claim 1, wherein the display componentfurther comprises a reflection prevention layer directly disposed on thetouch sensing layer without an adhesive layer therebetween.
 12. Theflexible display device of claim 11, wherein the reflection preventionlayer comprises: a black matrix disposed on the uppermost insulatinglayer and overlapping with the non-light emitting area; and a pluralityof color filters disposed on the uppermost insulating layer andrespectively overlapping with the plurality of light emitting areas. 13.The flexible display device of claim 1, wherein the uppermost insulatinglayer comprises an inorganic material or an organic material.
 14. Aflexible display device comprising: a protection component; a window; adisplay component disposed between the protection component and thewindow, the display component comprising a plurality of light emittingareas and a non-light emitting area adjacent to the plurality of lightemitting area; a first adhesion layer to couple the display component tothe protection component; and a second adhesion layer to couple thedisplay component to the window, wherein the display componentcomprises: a base layer comprising a lower surface contacting the firstadhesion layer; a plurality of light emitting diodes disposed on thebase layer; an inorganic layer on the plurality of light emittingdiodes; a conductive pattern disposed on the inorganic layer without anadhesive layer therebetween; an insulating layer on the conductivepattern and comprising an upper surface contacting the second adhesionlayer, and wherein a thickness of the display component between thelower surface of the base layer and the upper surface of the insulatinglayer is about 30 μm to about 50 μm and is less than a sum ofthicknesses of the protection component and the window.
 15. A flexibledisplay device comprising: a protection component; a window; a displaycomponent disposed between the protection component and the window; afirst adhesion layer to couple the display component to the protectioncomponent; and a second adhesion layer to couple the display componentto the window, wherein the display component comprises: a display panelcomprising a first surface contacting the first adhesion layer and asecond surface opposing the first surface, the display panel comprisinga display area comprising a plurality of light emitting areas and anon-light emitting area adjacent to the plurality of light emittingareas and a non-display area adjacent to the display area; and a touchsensing layer directly disposed on the second surface without anadhesive layer therebetween and comprising a third surface contactingthe second surface and a fourth surface opposing the third surface; anda reflection prevention layer directly disposed on the fourth surfacewithout an adhesive layer therebetween and comprising a fifth surfacecontacting the fourth surface and a sixth surface opposing the fifthsurface, and wherein: a thickness of the display component between thefirst surface and the sixth surface is about 30 μm to about 50 μm and isless than a sum of thicknesses of the protection component and thewindow; the display panel comprises a base layer providing the firstsurface; and the reflection prevention layer comprise a plurality ofcolor filters and each of the plurality of color filters includes aupper surface defining the sixth surface.
 16. The flexible displaydevice of claim 15, wherein the reflection prevention layer furthercomprises a black matrix disposed directly on the fourth surface. 17.The flexible display device of claim 16, wherein: the black matrixcomprises: a light shield portion overlapping with the non-lightemitting area; and a bezel portion adjacent to the light shield portion;and the bezel portion is thicker than the light shield portion.
 18. Theflexible display device of claim 17, wherein the light shield portionand the bezel portion are integrated with each other.
 19. The flexibledisplay device of claim 17, wherein: the bezel portion comprises aplurality of layers; and a first layer of the plurality of layers isintegrated with the light shield portion.
 20. The flexible displaydevice of claim 15, wherein the touch sensing layer comprises at leastone insulating layer providing the third surface and the fourth surfaceand a conductive pattern.